Details：
Manufacturing Capacity
24-hour turn around for 2-layer PCBs, 2-7 working days for multilayer PCBs;
Over 3000 different models supplied every month.
Production Capabilities (Rigid PCB):
1. Material: FR4,High TG FR4，FR4 Halogen free, Aluminum based FR4, Rogers material etc.
2. Layer counts: 2-28L
3.Finished Copper:0.5-5OZ
4.Finished Board thickness: 0.2-6.0mm
5.Max finished board size: 24x35 inch
6.Mini line width: 4mil
7.Mini line space: 4mil
8.Mini overall board outline tolerance: +/-0.1mm
9.Mini drilling hole size:0.2mm
10.Mini drilling slot size: 0.6mm
11.Mini via pad diameter: 18mil
12.Max Aspect Ratio: 12:1
13.Mini solder mask bridge: 4mil (SMT pads space can be 8mil)
14.Mini solder mask thickness: 10um
15.Solder mask hardness: 6H
16.Mini silkscreen tracks: 5mil
17.Mini silkscreen tracks height: 30mil
18.Mini space between holes to tracks: 8mil(2-6L), 10mil(>=8L)
19.Solder mask color(LPI): Green, Red, White, Blue, Black, Yellow, Matt etc.
20.Silkscreen(Legend) color: White, Black, Yellow etc.
21.Surface finish: HAL, Lead Free HAL, Immersion Gold(ENIG), Immersion Tin/Silver, OSP etc.
22.Special technology: Gold finger, Peelable mask, Blinded or Buried vias, Impedance control etc.
23.Reliable test: Flying Probe Test, Fixture Test, Impedance Test, Solderbility Test, Micro-section Analysis, Thermal Shock Test, Hi-Pot Test etc.
24.Wrap and twist: <0.7%
25.Flammability: 94V-0
26.Inspection standard: IPC-A-600F