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4-Layers TG170 Heavy Copper Immersion Silver Board
Layer count: 4
Raw material： FR4 TG170 ShengYi S1141
Board thickness：1.6mm
Inner/Outer Copper thickness：70um(2oz All)
Copper thickness in the hole barrel：25um
Minimum hole diameter：0.2mm（Laser drill hole）
Laser number of times：1
Laminating number of times：1
Soldermask Ink Color：Colorless ink
Character Screen： No
Surface Finishing：Immersion Silver
Application：UAV
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PCB Manufacturing Capacity:
►Base material: FR-4｜High Tg｜CEM-1｜CEM3｜Halogen-free｜PTFE｜Teflon｜Aluminum｜Copper｜Ceramic PCB｜Polyimide｜FR-5,etc......
► PCBs: Rigid (1-64 Layers), Flexible (1-10 Layers), Rigid-flex (2-20 Layers), Flex (1-8 Layers), MCPCB (Aluminum and Copper 1-4 Layers)
► Board thickness: 0.2mm–10mm
► Copper thickness: 0.25 oz -12 oz
► Usual Panel Size: 500 mm × 880 mm (For 1~64 Layer PCB)
► Max Panel Size: 1500 mm × 560 mm (For 1~2 Layer PCB)
► Min. Hole Size: 0.075mm (3mil)
► Min. Line Width/Spacing: 3mil
► Surface Finishing: HASL / HAL, HASL Lead Free, ENIG, Immersion silver, Immersion tin, OSP, Plating Hard Gold, etc......
► Solder Mask Color: White, Black, Yellow, Green, Blue, Red, Purple ,etc......
► Silkscreen Color: Black, White, Yellow, Red, Blue, etc......
► Special Process: Buried hole, Blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, ► Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
PCB Assembly Capacity:
► SMT Capability: 5KK points/Day, single-sided / double-sided, 10 Lines
► Reject rate of components: 0.3% (Capacitor and Resistance) No (IC)
► Min. Package: 01005 chip / 0.35 Pitch BGA
► Min. Precision: +/-0.04mm
► Min. Precison of IC: +/-0.03mm
► SMD Size: 0201-150mm
► Max. Height of components by machine: 30mm
► Min. Pin pitch of SMT: 0.2mm
► Min. Ball pitch of SMT: 0.2mm
► Min. Precision of Stencil: 5um
► PCB Size of Assembly: 5×5mm-500×1500mm
► PCB Thickness of Assembly: 0.1-10mm
► BGA/μBGA: Available; Solder paste / glue processing
► DIP capacity: 0.30 million points per day
► Max. Capability: Stable support for 200 products on production line at the same time
► Functional testing & Casing assembly: Upon customer’s requirements
Full Range Of Testing Services:
► AOI
► Function testing
► In circuit testing
► X-ray for BGA testing
► 3D paste thickness test
► Flash testing and earth bonding tests can also be undertaken where required
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
Advantages:
► No MOQ
► 20 years of PCB & PCBA turnkey services
► Quick turn, Prototype, Low & medium & high volume
► Components sourcing,ODM&OEM services provide
► ISO 9001-2015, ISO14001-2015, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
► 100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
► 100% AOI inspection, including X-ray, 3D microscope and ICT
► Fast response within 24 hours, great pre-sales, sales, after-sales
► All kinds of Export / Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
► All kinds of payment: T/T
► Guarantee Sales Service, for all problems encountered kindly contact us, we will do the after service any time.
Welcome foreign company join us！
Contact Person： Kevin.Ho