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HDI PCB
18Layers 2-steps HDI PCB
  • 18Layers 2-steps HDI PCB

  • Classify:HDI PCB

  • Release time:2024-5-17 9:48:19

  • market price:¥0.00

  • Product profile:

    Parameters
    Layers: 18
    Board Thicknes:  1.78±0.18mm
    Copper Thickness: All 1oz(35um)
    Surface Treatment:    ENIG 3u"

    Crafts
    2 Steps HDI Board
    Resin Plug Hole Technology

    Applications: Communication

  • Hotline:0086-755-27094118
describe

18Layers 2-steps HDI PCB

参数                  
   Layers: 18                                             
      Board Thicknes:  1.78±0.18mm         
      Copper Thickness: All 1oz(35um)
      Surface Treatment:    ENIG 3u"          
工艺                  

   2 Steps HDI Board                             

       Resin Plug Hole Technology           
应用领域

     Communication                                   

Flytech Two-dimensional Code
PCB Manufacturing Capacity:
 
►Base material: FR-4High TgCEM-1CEM3Halogen-freePTFETeflonAluminumCopperCeramic PCBPolyimide|FR-5,etc......
► PCBs:  Rigid (1-64 Layers), Flexible (1-10 Layers), Rigid-flex (2-20 Layers), Flex (1-8 Layers), MCPCB (Aluminum and Copper 1-4 Layers)
► Board thickness:    0.2mm–10mm
► Copper thickness:  0.25 oz -12 oz
► Usual Panel Size:   500 mm × 880 mm  (For 1~64 Layer PCB)
► Max Panel Size:     1500 mm × 560 mm  (For 1~2   Layer PCB)
► Min. Hole Size:   0.075mm (3mil)
► Min. Line Width/Spacing:  3mil
► Surface Finishing:  HASL / HAL, HASL Lead Free, ENIG, Immersion silver, Immersion tin, OSP, Plating Hard Gold, etc......
► Solder Mask Color:  White, Black, Yellow, Green, Blue, Red, Purple ,etc......
► Silkscreen Color: Black, White, Yellow, Red, Blue, etc......
► Special Process: Buried hole, Blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, ► Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
 
PCB Assembly Capacity:
 
► SMT Capability:   5KK points/Day, single-sided / double-sided, 10 Lines
► Reject rate of components:   0.3% (Capacitor and Resistance) No (IC)
► Min. Package:   01005 chip / 0.35 Pitch BGA
► Min. Precision:  +/-0.04mm
► Min. Precison of IC:  +/-0.03mm
► SMD Size:  0201-150mm
► Max. Height of components by machine: 30mm
► Min. Pin pitch of SMT:   0.2mm
► Min. Ball pitch of SMT:  0.2mm
► Min. Precision of Stencil:  5um
► PCB Size of Assembly:  5×5mm-500×1500mm
► PCB Thickness of Assembly:  0.1-10mm
► BGA/μBGA:   Available; Solder paste / glue processing
► DIP capacity:  0.30 million points per day
► Max. Capability:  Stable support for 200 products on production line at the same time
► Functional testing & Casing assembly:   Upon customer’s requirements
 
Full Range Of Testing Services:
► AOI
► Function testing
► In circuit testing
► X-ray for BGA testing
► 3D paste thickness test
► Flash testing and earth bonding tests can also be undertaken where required
     Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
 
Advantages:
 
► No MOQ
► 20 years of PCB & PCBA turnkey services
► Quick turn, Prototype, Low & medium & high volume
► Components sourcing,ODM&OEM services provide
► ISO 9001-2015, ISO14001-2015, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
► 100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
► 100% AOI inspection, including X-ray, 3D microscope and ICT
► Fast response within 24 hours, great pre-sales, sales, after-sales
► All kinds of Export / Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
► All kinds of payment: T/T
► Guarantee Sales Service, for all problems encountered kindly contact us, we will do the after service any time.
 

 

 

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