PCB Manufacturing Capacity:
	
		 
	
		►Base material: FR-4|High Tg|CEM-1|CEM3|Halogen-free|PTFE|Teflon|Aluminum|Copper|Ceramic PCB|Polyimide|FR-5,etc......
	
		► PCBs:  Rigid (1-64 Layers), Flexible (1-10 Layers), Rigid-flex (2-20 Layers), Flex (1-8 Layers), MCPCB (Aluminum and Copper 1-4 Layers)
	
		► Board thickness:    0.2mm–10mm
	
		► Copper thickness:  0.25 oz -12 oz
	
		► Usual Panel Size:   500 mm × 880 mm  (For 1~64 Layer PCB)
	
		► Max Panel Size:     1500 mm × 560 mm  (For 1~2   Layer PCB)
	
		► Min. Hole Size:   0.075mm (3mil)
	
		► Min. Line Width/Spacing:  3mil
	
		► Surface Finishing:  HASL / HAL, HASL Lead Free, ENIG, Immersion silver, Immersion tin, OSP, Plating Hard Gold, etc......
	
		► Solder Mask Color:  White, Black, Yellow, Green, Blue, Red, Purple ,etc......
	
		► Silkscreen Color: Black, White, Yellow, Red, Blue, etc......
	
		► Special Process: Buried hole, Blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, ► Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
	
		 
	
		PCB Assembly Capacity:
	
		 
	
		► SMT Capability:   5KK points/Day, single-sided / double-sided, 10 Lines
	
		► Reject rate of components:   0.3% (Capacitor and Resistance) No (IC)
	
		► Min. Package:   01005 chip / 0.35 Pitch BGA
	
		► Min. Precision:  +/-0.04mm
	
		► Min. Precison of IC:  +/-0.03mm
	
		► SMD Size:  0201-150mm
	
		► Max. Height of components by machine: 30mm
	
		► Min. Pin pitch of SMT:   0.2mm
	
		► Min. Ball pitch of SMT:  0.2mm
	
		► Min. Precision of Stencil:  5um
	
		► PCB Size of Assembly:  5×5mm-500×1500mm
	
		► PCB Thickness of Assembly:  0.1-10mm
	
		► BGA/μBGA:   Available; Solder paste / glue processing
	
		► DIP capacity:  0.30 million points per day
	
		► Max. Capability:  Stable support for 200 products on production line at the same time
	
		► Functional testing & Casing assembly:   Upon customer’s requirements
	
		 
	
		Full Range Of Testing Services:
	
		► AOI
	
		► Function testing
	
		► In circuit testing
	
		► X-ray for BGA testing
	
		► 3D paste thickness test
	
		► Flash testing and earth bonding tests can also be undertaken where required
	
		     Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
	
		 
	
		Advantages:
	
		 
	
		► No MOQ
	
		► 20 years of PCB & PCBA turnkey services
	
		► Quick turn, Prototype, Low & medium & high volume
	
		► Components sourcing,ODM&OEM services provide
	
		► ISO 9001-2015, ISO14001-2015, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
	
		► 100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
	
		► 100% AOI inspection, including X-ray, 3D microscope and ICT
	
		► Fast response within 24 hours, great pre-sales, sales, after-sales
	
		► All kinds of Export / Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
	
		► All kinds of payment: T/T, Paypal, Western Union
	
		► Guarantee Sales Service, for all problems encountered kindly contact us, we will do the after service any time.