6-Layers TG170 Heavy Copper ENIG Board
6-Layers TG170 Heavy Copper ENIG PCB
Layer count: 6
Raw material： FR4 TG170 ShengYi S1141
Board thickness：1.6mm
Inner/Outer Copper thickness：105um/35um(3oz/1oz All)
Copper thickness in the hole barrel：25um
Minimum hole diameter：0.2mm（Laser drill hole）
Laser number of times：2
Laminating number of times：2
Soldermask Ink Color：Matte Black
Character Screen： White
Surface Finishing：Immersion gold 3u"
Application：UAV (unmanned aerial vehicle)